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Semiconductor & Electronics
ULVAC, Inc. is setting up a new production base in Japan for its continuous vacuum melting furnaces. These furnaces are used in the manufacturing of rare earth magnets. The timing…
TekStart And Techno Math Partner on CODEC Distribution
TekStart, a prominent provider of semiconductor and semiconductor intellectual property (SIP) solutions,…
Mitsui Fudosan launches RISE-A for semiconductor growth
Mitsui Fudosan Co., Ltd. and semiconductor-related volunteers have established the general incorporated…
Rapidus, Siemens partner to advance 2nm Chip production
Rapidus Corporation, a top developer of advanced logic semiconductors, is teaming up…
Kioxia expands 8th-Gen BiCS FLASH SSDs for AI and HPC
Kioxia Corporation has launched the CD9P Series. These are new PCIe 5.0…
Cadence and Samsung Team Up to Advance Chip Design
Cadence Design Systems, Inc. announced a new, multi-year partnership with Samsung Foundry.…
Mitsubishi Electric Corp, GE Bernova sign HVDC chip MoU
Mitsubishi Electric Corporation and GE Vernova, Inc. have agreed to strengthen cooperation…
STMicro Introduces IO-Link Kit for Factory Automation
STMicroelectronics has announced the P-NUCLEO-IOD5A1 IO-Link development kit, which simplifies the construction…
Cadence Expands Design IP for Intel 18A and 18A-P Chips
Cadence announced on April 29 (US time) that it has significantly expanded…
TekStart And Techno Math Partner on CODEC Distribution
TekStart, a prominent provider of semiconductor and semiconductor intellectual property (SIP) solutions,…
Mitsui Fudosan launches RISE-A for semiconductor growth
Mitsui Fudosan Co., Ltd. and semiconductor-related volunteers have established the general incorporated…
Rapidus, Siemens partner to advance 2nm Chip production
Rapidus Corporation, a top developer of advanced logic semiconductors, is teaming up…
Kioxia expands 8th-Gen BiCS FLASH SSDs for AI and HPC
Kioxia Corporation has launched the CD9P Series. These are new PCIe 5.0…
Cadence and Samsung Team Up to Advance Chip Design
Cadence Design Systems, Inc. announced a new, multi-year partnership with Samsung Foundry.…
Mitsubishi Electric Corp, GE Bernova sign HVDC chip MoU
Mitsubishi Electric Corporation and GE Vernova, Inc. have agreed to strengthen cooperation…
STMicro Introduces IO-Link Kit for Factory Automation
STMicroelectronics has announced the P-NUCLEO-IOD5A1 IO-Link development kit, which simplifies the construction…
Cadence Expands Design IP for Intel 18A and 18A-P Chips
Cadence announced on April 29 (US time) that it has significantly expanded…
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