日本語 
Panasonic Environmental Engineering Co., Ltd., a group company of Panasonic HVAC & CC Corporation that handles the supply, purification, and recycling of water, air, soil, and energy, will launch a “wastewater treatment and resource recovery business” for semiconductor and electronic device factories. This business will cover not only metal recovery and wastewater treatment, but also chemicals required in semiconductor production processes and copper plating processes for glass substrates.
In recent years, with the rapid spread of AI technology, the construction and expansion of semiconductor and electronic device factories have been progressing on a global scale. On the other hand, major challenges have emerged, such as the increased use of chemicals such as stripping solutions in the manufacturing process, the need for more sophisticated wastewater treatment, and the rising costs of industrial waste disposal.
Environmental Engineering has previously provided wastewater treatment facilities and chemical supply and recycling technologies for resist stripping processes in lithium-ion battery and LCD panel factories. Now, by combining our accumulated know-how with new proprietary technologies, we will provide optimal solutions for both the “inlet (chemicals)” and “outlet (wastewater treatment and metal recovery)” of semiconductor and electronic device production lines, contributing to the balance between environmental challenges and economic efficiency for factories.
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In the core of our business, “Output (Wastewater Treatment and Metal Recovery),” we have developed a unit-type metal recovery system (RARELOOP) that efficiently recovers valuable metals from wastewater containing many chemical substances, and a wastewater treatment system that processes difficult-to-treat wastewater using our unique coagulation and decomposition technologies. In addition, in “Input (Chemical Solutions),” we have developed an environmentally friendly resist stripping solution for semiconductor back-end processes. Furthermore, for “glass substrates,” which are expected to be the next generation of semiconductor packaging, we have established a process that achieves both uniformity of copper plating and ensures adhesion strength. By combining these solutions, we will respond to increasingly sophisticated production challenges and resource recycling needs.
Going forward, Environmental Engineering will position the semiconductor and electronic device fields as growth areas, and through this project, will promote advanced resource recycling and reduction of environmental impact, contributing to the realization of carbon neutrality and a circular economy.
SOURCE: PRTimes
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