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U.S.-Japan Launch $1 Billion GENIUS Initiative to Strengthen Semiconductor and AI Leadership

The United States and Japan together declared the launch of the Global Engineering and Innovation for Next-Generation Integrated Systems (GENIUS) initiative - a USD 1 billion collaboration, mainly focusing on…

Infostellar, CONTEC Partner to Boost GSaaS Collaboration

Infostellar Inc., a provider of Ground Segment as a Service (GSaaS) for…

Nippon Steel Corp and U.S. Steel Seal Major Industry Deal

Nippon Steel Corporation and its subsidiary, Nippon Steel North America, Inc., are…

Yokogawa, Shell partner on AI and robotics for maintenance

Yokogawa Electric Corporation announces that it has formalized a long-term agreement with…

Global Electronics and MEMSIC Sign Agency Agreement

Global Electronics Corporation, a comprehensive electronic equipment company, is pleased to announce…

Avio uses 3DEXPERIENCE to drive space tech innovation

Dassault Systèmes announced that AVIO, an Italy-based space propulsion technology leader, has…

Ipla’s Airpla and MOTORJIM Start Vehicle Data Sharing

Ipla Inc., which operates the customer acquisition support system "Airpla" for car…

Cadence and Samsung Team Up to Advance Chip Design

Cadence Design Systems, Inc. announced a new, multi-year partnership with Samsung Foundry.…

Mitsubishi Electric Builds Edge LLM for Manufacturing Use

Mitsubishi Electric Corporation announced that it has developed a language model tailored…

Infostellar, CONTEC Partner to Boost GSaaS Collaboration

Infostellar Inc., a provider of Ground Segment as a Service (GSaaS) for…

Nippon Steel Corp and U.S. Steel Seal Major Industry Deal

Nippon Steel Corporation and its subsidiary, Nippon Steel North America, Inc., are…

Yokogawa, Shell partner on AI and robotics for maintenance

Yokogawa Electric Corporation announces that it has formalized a long-term agreement with…

Global Electronics and MEMSIC Sign Agency Agreement

Global Electronics Corporation, a comprehensive electronic equipment company, is pleased to announce…

Avio uses 3DEXPERIENCE to drive space tech innovation

Dassault Systèmes announced that AVIO, an Italy-based space propulsion technology leader, has…

Ipla’s Airpla and MOTORJIM Start Vehicle Data Sharing

Ipla Inc., which operates the customer acquisition support system "Airpla" for car…

Cadence and Samsung Team Up to Advance Chip Design

Cadence Design Systems, Inc. announced a new, multi-year partnership with Samsung Foundry.…

Mitsubishi Electric Builds Edge LLM for Manufacturing Use

Mitsubishi Electric Corporation announced that it has developed a language model tailored…

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