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Semiconductor & Electronics
Techno Horizon has signed an exclusive distribution agreement with US-based audiovisual (AV) equipment manufacturer WyreStorm Technologies Limited to distribute its products in Japan. The agreement will expand Techno Horizon’s AV…
Mitsui Fudosan launches RISE-A for semiconductor growth
Mitsui Fudosan Co., Ltd. and semiconductor-related volunteers have established the general incorporated…
Rapidus, Siemens partner to advance 2nm Chip production
Rapidus Corporation, a top developer of advanced logic semiconductors, is teaming up…
Kioxia expands 8th-Gen BiCS FLASH SSDs for AI and HPC
Kioxia Corporation has launched the CD9P Series. These are new PCIe 5.0…
Cadence and Samsung Team Up to Advance Chip Design
Cadence Design Systems, Inc. announced a new, multi-year partnership with Samsung Foundry.…
Mitsubishi Electric Corp, GE Bernova sign HVDC chip MoU
Mitsubishi Electric Corporation and GE Vernova, Inc. have agreed to strengthen cooperation…
STMicro Introduces IO-Link Kit for Factory Automation
STMicroelectronics has announced the P-NUCLEO-IOD5A1 IO-Link development kit, which simplifies the construction…
Cadence Expands Design IP for Intel 18A and 18A-P Chips
Cadence announced on April 29 (US time) that it has significantly expanded…
Zeon and Sino Expand Carbon Nanotube Paste for EVs
Zeon Corporation (Zeon) and Sino Applied Technology (SiAT) are thrilled to announce…
Mitsui Fudosan launches RISE-A for semiconductor growth
Mitsui Fudosan Co., Ltd. and semiconductor-related volunteers have established the general incorporated…
Rapidus, Siemens partner to advance 2nm Chip production
Rapidus Corporation, a top developer of advanced logic semiconductors, is teaming up…
Kioxia expands 8th-Gen BiCS FLASH SSDs for AI and HPC
Kioxia Corporation has launched the CD9P Series. These are new PCIe 5.0…
Cadence and Samsung Team Up to Advance Chip Design
Cadence Design Systems, Inc. announced a new, multi-year partnership with Samsung Foundry.…
Mitsubishi Electric Corp, GE Bernova sign HVDC chip MoU
Mitsubishi Electric Corporation and GE Vernova, Inc. have agreed to strengthen cooperation…
STMicro Introduces IO-Link Kit for Factory Automation
STMicroelectronics has announced the P-NUCLEO-IOD5A1 IO-Link development kit, which simplifies the construction…
Cadence Expands Design IP for Intel 18A and 18A-P Chips
Cadence announced on April 29 (US time) that it has significantly expanded…
Zeon and Sino Expand Carbon Nanotube Paste for EVs
Zeon Corporation (Zeon) and Sino Applied Technology (SiAT) are thrilled to announce…
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