Semiconductor & Electronics

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TIER IV Advances Open-Source Chips for Autonomous Cars

 TIER IV, the pioneering force behind open-source software for autonomous driving, has joined the Next-Generation Edge AI Semiconductor Research and Development Program led by the Japan Science and Technology Agency…

Kioxia expands 8th-Gen BiCS FLASH SSDs for AI and HPC

Kioxia Corporation has launched the CD9P Series. These are new PCIe 5.0…

Cadence and Samsung Team Up to Advance Chip Design

Cadence Design Systems, Inc. announced a new, multi-year partnership with Samsung Foundry.…

Mitsubishi Electric Corp, GE Bernova sign HVDC chip MoU

Mitsubishi Electric Corporation and GE Vernova, Inc. have agreed to strengthen cooperation…

STMicro Introduces IO-Link Kit for Factory Automation

STMicroelectronics has announced the P-NUCLEO-IOD5A1 IO-Link development kit, which simplifies the construction…

Cadence Expands Design IP for Intel 18A and 18A-P Chips

Cadence announced on April 29 (US time) that it has significantly expanded…

Zeon and Sino Expand Carbon Nanotube Paste for EVs

Zeon Corporation (Zeon) and Sino Applied Technology (SiAT) are thrilled to announce…

Soar Inks Consulting contract with OPERA Solutions Inc.

Soar Inc., a SAXA Group company that provides contract development and manufacturing…

Resonac, Yokohama National University Form Partnership

Resonac Inc. and Yokohama National University signed a comprehensive collaboration agreement on…

Kioxia expands 8th-Gen BiCS FLASH SSDs for AI and HPC

Kioxia Corporation has launched the CD9P Series. These are new PCIe 5.0…

Cadence and Samsung Team Up to Advance Chip Design

Cadence Design Systems, Inc. announced a new, multi-year partnership with Samsung Foundry.…

Mitsubishi Electric Corp, GE Bernova sign HVDC chip MoU

Mitsubishi Electric Corporation and GE Vernova, Inc. have agreed to strengthen cooperation…

STMicro Introduces IO-Link Kit for Factory Automation

STMicroelectronics has announced the P-NUCLEO-IOD5A1 IO-Link development kit, which simplifies the construction…

Cadence Expands Design IP for Intel 18A and 18A-P Chips

Cadence announced on April 29 (US time) that it has significantly expanded…

Zeon and Sino Expand Carbon Nanotube Paste for EVs

Zeon Corporation (Zeon) and Sino Applied Technology (SiAT) are thrilled to announce…

Soar Inks Consulting contract with OPERA Solutions Inc.

Soar Inc., a SAXA Group company that provides contract development and manufacturing…

Resonac, Yokohama National University Form Partnership

Resonac Inc. and Yokohama National University signed a comprehensive collaboration agreement on…

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