Samsung and Broadcom Expand Partnership for Next-Generation AI Chips

Samsung Electronics and Broadcom said they will team up more closely. Their work will cover memory, foundry technology, and advanced packaging for the next round of AI systems.

The agreement was signed on August 25, 2026, and Samsung and Broadcom later made it public at the AI Summit held at The Midway in San Francisco. Samsung Foundry President and Head Jinman Han, Broadcom President and CEO Hock Tan, along with executives from both companies and South Korean government officials, attended the event.

The companies expect their combined collaboration in memory and foundry to exceed $200 billion over the next five years through 2030.

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In memory, Samsung and Broadcom will work on supplying advanced solutions, including high-bandwidth memory (HBM), for Broadcom’s next-generation semiconductor chips and AI accelerators.

The foundry collaboration will focus on Broadcom products, including wireless broadband solutions, using Samsung’s sub-2 nanometer process technology. The partnership will also cover advanced packaging, including 2.3D and 2.5D integration based on Samsung’s 2nm process.

The goal is to support higher-performance and lower-power semiconductors for AI and networking. The expanded partnership also strengthens Samsung’s role in providing integrated semiconductor capabilities spanning memory, logic, foundry and advanced packaging.