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Coherent has introduced PhotonLink, an integrated optics platform built to meet the rising connectivity needs of generation AI data centers. This platform combines technologies with precise assembly, testing and manufacturing expertise. It supports -packaged optics, near-packaged optics and new forms of chip-to-chip connectivity that are essential for modern AI systems.
PhotonLink covers four parts of the optical path: Generate, Shape, Guide and Receive. The platform offers a range of components including indium lasers, VCSEL arrays, silicon photonics, specialty fibers, micro-optics, isolators and photodetectors. These parts can be combined into modules and assemblies that fit different AI infrastructure designs.
The goal is to bring connectivity closer to the computing and switching silicon. This helps handle the data demands of AI while keeping power use low and latency under control. Coherent says it already has over ten customers working with CPO and over ten with NPO. There are also than five projects focused on new chip-to-chip connectivity solutions. Revenue from PhotonLink is expected to start growing in the quarter of 2026.
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This launch shows a change in how AI data centers are built. Photonics is becoming more central to moving amounts of data quickly and efficiently between chips, servers and networking equipment. As AI clusters get bigger optical connectivity will play a role, in system performance and energy efficiency.
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