日本語 
Rigaku Corporation, a group company of Rigaku Holdings and a global solution partner for X-ray analysis equipment, has begun sales of the “XTRAIA MF-3400,” which measures wafer film thickness and composition during the semiconductor manufacturing process. This equipment enables highly accurate evaluation of materials essential for the mass production of next-generation memory chips and high-speed devices for AI, significantly contributing to improving productivity in the rapidly expanding semiconductor market.
In today’s world, where generative AI is becoming more widespread and data centers are expanding, semiconductors with high performance and energy efficiency are required as the infrastructure for supporting massive data processing. As a result, internal structures are becoming more complex, miniaturized, and three-dimensional. Currently, billions of tiny electronic components are integrated into a single semiconductor chip.
To stably manufacture such advanced structures, it is essential to have technology that can non-destructively and accurately measure the thickness of metal and insulating films at the nano-level.
Also Read: Mitsubishi Electric Unveils High-Isolation HVIGBT Modules
To address this issue, Rigaku has evolved the X-ray technology it has cultivated over many years and developed the “XTRAIA MF-3400” that is capable of measuring molybdenum, a material that is attracting attention as a next-generation material.
SOURCE: PRTimes
English