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Processing Data at the Edge: Why Electronics Are Moving Closer to the Source

For almost a decade, the dominant belief in technology was simple. Cloud first. Centralize everything. Push data to massive data centers and let scale handle the rest. It worked well…

Kioxia expands 8th-Gen BiCS FLASH SSDs for AI and HPC

Kioxia Corporation has launched the CD9P Series. These are new PCIe 5.0…

Infostellar, CONTEC Partner to Boost GSaaS Collaboration

Infostellar Inc., a provider of Ground Segment as a Service (GSaaS) for…

Nippon Steel Corp and U.S. Steel Seal Major Industry Deal

Nippon Steel Corporation and its subsidiary, Nippon Steel North America, Inc., are…

Yokogawa, Shell partner on AI and robotics for maintenance

Yokogawa Electric Corporation announces that it has formalized a long-term agreement with…

Global Electronics and MEMSIC Sign Agency Agreement

Global Electronics Corporation, a comprehensive electronic equipment company, is pleased to announce…

Avio uses 3DEXPERIENCE to drive space tech innovation

Dassault Systèmes announced that AVIO, an Italy-based space propulsion technology leader, has…

Ipla’s Airpla and MOTORJIM Start Vehicle Data Sharing

Ipla Inc., which operates the customer acquisition support system "Airpla" for car…

Cadence and Samsung Team Up to Advance Chip Design

Cadence Design Systems, Inc. announced a new, multi-year partnership with Samsung Foundry.…

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