Tokyo Seimitsu and Advantest Announce Joint Development of Die-Level Prober

Tokyo Seimitsu Co., Ltd. and Advantest Corporation announced today that they will jointly develop a die-level prober.

Semiconductors are expected to become increasingly sophisticated and complex in the future. Close collaboration within the semiconductor value chain is essential to quickly respond to ever-evolving market needs and provide customers with high-performance total test solutions.

Leveraging their respective expertise, the two companies will jointly develop a die-level prober that will provide the advanced probing capabilities essential for testing AI and high-performance computing (HPC) devices.

To achieve the high computing power required for AI model training, inference, and generation, advanced 2.5D/3D packaging technologies are being adopted for AI/HPC devices such as GPUs and CPUs. These advanced packages generate large amounts of heat due to the massive data processing, making it difficult to control the temperature during testing.

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This joint development project will strengthen next-generation probing and handling technologies that address these challenges and contribute to the growth of the AI/HPC market.

Comment from Advantest Group CEO Douglas Lefever: Advantest is actively collaborating with key companies in the semiconductor value chain to solve customer challenges in semiconductor testing, including the rapidly growing AI/HPC market. Through collaboration with Tokyo Seimitsu, Advantest will realize high-performance, comprehensive test solutions that meet customers’ future needs in die-level probes.

Comment from Ryuichi Kimura, President and CEO of Tokyo Seimitsu: “In response to the advances in AI/HPC technology that are bringing about changes in the world, we are proposing a variety of solutions centered on precision positioning technology. By collaborating with Advantest to promote the joint development of die-level probers, we will open up new possibilities for next-generation semiconductor testing, which is required in the AI/HPC era.”

SOURCE: PRTimes