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Semiconductor & Electronics
Japan is attempting something that most semiconductor veterans would call reckless. It wants to jump from 40nm class production straight to sub 2nm in about five years. That is not…
Mitsubishi Electric Corp, GE Bernova sign HVDC chip MoU
Mitsubishi Electric Corporation and GE Vernova, Inc. have agreed to strengthen cooperation…
STMicro Introduces IO-Link Kit for Factory Automation
STMicroelectronics has announced the P-NUCLEO-IOD5A1 IO-Link development kit, which simplifies the construction…
Cadence Expands Design IP for Intel 18A and 18A-P Chips
Cadence announced on April 29 (US time) that it has significantly expanded…
Zeon and Sino Expand Carbon Nanotube Paste for EVs
Zeon Corporation (Zeon) and Sino Applied Technology (SiAT) are thrilled to announce…
Soar Inks Consulting contract with OPERA Solutions Inc.
Soar Inc., a SAXA Group company that provides contract development and manufacturing…
Resonac, Yokohama National University Form Partnership
Resonac Inc. and Yokohama National University signed a comprehensive collaboration agreement on…
NSSOL Launches E-Trading Platform “CONTRACT CROSS”
Nippon Steel Solutions Co., Ltd. (NSSOL) announced on the 14th that it…
NTT Unveils AI Chip for Real-Time 4K Video Processing
NTT Corporation (NTT) announced a new, large-scale integration (LSI) for the real-time…
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