Semiconductor & Electronics
Tokyo Electron and IBM Continuing Collaboration in Joint Research and Development of Advanced Semiconductor Technologies
IBM and Tokyo Electron Limited (TEL) announced that they have extended their agreement for joint research and development of advanced semiconductor technologies. The new five-year agreement will focus on the continued advancement of next-generation semiconductor nodes and architectures that will support the era of generative AI. The agreement builds on more than 20 years of joint research and development partnership between IBM and TEL, which has resulted in several breakthroughs together, including the development of a new laser delamination process for manufacturing 300mm silicon chip wafers for 3D chip stacking technology. This collaboration brings together IBM's expertise in semiconductor process integration technology and TEL's expertise in cutting-edge semiconductor manufacturing equipment to explore smaller node and chiplet architecture technologies to achieve the performance and energy efficiency requirements of future AI generations.…
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