Semiconductor & Electronics

Applied Materials Unveils Next-Generation Electron Beam Tool to Speed ​​Defect Review of Semiconductor Chips

Applied Materials, Inc. announced a new defect review tool to help leading semiconductor manufacturers continue to push the boundaries of chip miniaturization. The SEMVision™ H20 combines the industry's most sensitive electron beam technology with advanced AI image recognition to better and faster analyze nanoscale defects buried in the world's most advanced semiconductor chips. Electron beam imaging has long been a key tool for inspecting extremely small defects that cannot be identified by optical techniques. Its ultra-high resolution allows the analysis of tiny defects hidden within billions of nanoscale circuit patterns. Traditionally, wafers are first optically scanned to identify potential defects, and then an electron beam is used to more precisely characterize the defects. However, with the advent of the "angstrom era," where the smallest features on chips are only a…