Semiconductor & Electronics

JTEKT Unveils Advanced Thermal Processing System for Next-Generation Semiconductor Packages

The JTEKT Group’s subsidiary JTEKT Thermo Systems has launched a new thermal processing machine designed specifically for advanced semiconductor packaging. Named the SO2-60-F, this system is intended to support evolving semiconductor package technologies, particularly large-substrate packaging used in high-performance computing and AI applications. The product launch reflects ongoing efforts among Japanese manufacturers to strengthen domestic semiconductor production capabilities and respond to global demand for sophisticated chip technologies. The SO2-60-F joins a growing lineup of processing equipment aimed at meeting the rigorous performance requirements of next-generation chips, including those used in artificial intelligence, automotive electronics, and data centers. Its introduction demonstrates the strategic role that Japanese industrial equipment manufacturers play in the semiconductor supply chain. What the SO2-60-F Offers Thermal processing systems, like the SO2-60-F, are key in semiconductor manufacturing. They…