コンピューティング

SanDisk and SK hynix Team Up on HBF Memory Standard

SanDisk Corporation, announced that it has signed a memorandum of understanding (MOU) with SK hynix to jointly develop specifications for HBF (High Bandwidth Flash), a next-generation memory technology designed to deliver breakthrough capacity and performance for AI inference workloads. Under the agreement, both companies will work to standardize the HBF specification, define technical requirements, and foster a technology ecosystem to support its adoption. “By working with SK hynix to define the HBF specification, we are addressing the critical need for scalable memory in the AI industry,” said Alper Ilkbahar, Executive Vice President and Chief Technology Officer at SanDisk, and a member of the HBF Technical Advisory Board. “This collaboration equips the industry with new tools to drive innovation and meet the exponential data demands of future applications. Together, we can…