OKI builds High-Accuracy Via Simulation for AI data centers

OKI Circuit Technology has developed high-accuracy simulation technology for high-frequency vias in 1.6 Tbps-class high-speed PCBs. The technology allows precise control of via characteristics, which is critical for multilayer PCBs operating at increasingly higher frequencies. By using this simulation-based design, OKI can shorten development times and help customers bring high-transmission PCBs to mass production faster.

As AI systems, data centers, and AI semiconductors grow larger and faster, PCBs have become more multilayered and complex. Vias, which connect the layers electrically, are key points affecting high-frequency signals. Controlling via impedance is essential to reduce signal reflection and transmission loss. Conventional modeling struggles at frequencies above 50 GHz because it cannot fully account for manufacturing variations and material properties.

OKI’s new simulation technology uses accumulated evaluation data to model vias accurately before fabrication. It considers dimensions, manufacturing tolerances, and material characteristics to optimize via structure and ensure reliable signal quality in actual products. The technology uses 3D electromagnetic analysis and builds on OKI’s in-house database to improve simulation accuracy.

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OKI will showcase this technology at SWTest Asia 2025 in Fukuoka from November 20 to 22, 2025.