{"id":8620,"date":"2025-04-03T10:54:16","date_gmt":"2025-04-03T10:54:16","guid":{"rendered":"https:\/\/itbusinesstoday.com\/?p=8620"},"modified":"2025-05-06T09:16:10","modified_gmt":"2025-05-06T09:16:10","slug":"tokyo-electron-and-ibm-continuing-collaboration-in-joint-research-and-development-of-advanced-semiconductor-technologies","status":"publish","type":"post","link":"https:\/\/itbusinesstoday.com\/ja\/industrial-tech\/semiconductorandelectronics\/tokyo-electron-and-ibm-continuing-collaboration-in-joint-research-and-development-of-advanced-semiconductor-technologies\/","title":{"rendered":"\u6771\u4eac\u30a8\u30ec\u30af\u30c8\u30ed\u30f3\u3068IBM\u3001\u5148\u7aef\u534a\u5c0e\u4f53\u6280\u8853\u306e\u5171\u540c\u7814\u7a76\u958b\u767a\u3067\u5354\u696d\u3092\u7d99\u7d9a"},"content":{"rendered":"

IBM\u3068\u6771\u4eac\u30a8\u30ec\u30af\u30c8\u30ed\u30f3\u682a\u5f0f\u4f1a\u793e\uff08\u6771\u4eac\u90fd\u6e2f\u533a\u3001\u793e\u9577\uff1a\u7af9\u4e2d\u535a\u53f8\uff09\u306f\u3001\u5148\u7aef\u534a\u5c0e\u4f53\u6280\u8853\u306e\u5171\u540c\u7814\u7a76\u958b\u767a\u306b\u95a2\u3059\u308b\u5951\u7d04\u3092\u5ef6\u9577\u3057\u305f\u3053\u3068\u3092\u767a\u8868\u3057\u307e\u3057\u305f\u30025\u5e74\u9593\u306e\u65b0\u305f\u306a\u5951\u7d04\u3067\u306f\u3001\u30b8\u30a7\u30cd\u30ec\u30fc\u30c6\u30a3\u30d6AI\u306e\u6642\u4ee3\u3092\u652f\u3048\u308b\u6b21\u4e16\u4ee3\u534a\u5c0e\u4f53\u30ce\u30fc\u30c9\u304a\u3088\u3073\u30a2\u30fc\u30ad\u30c6\u30af\u30c1\u30e3\u306e\u7d99\u7d9a\u7684\u306a\u9032\u5c55\u306b\u7126\u70b9\u3092\u5f53\u3066\u3066\u3044\u304d\u307e\u3059\u3002<\/p>

\u4eca\u56de\u306e\u5408\u610f\u306f\u3001IBM\u3068\u6771\u4eac\u30a8\u30ec\u30af\u30c8\u30ed\u30f3\u3068\u306e20\u5e74\u4ee5\u4e0a\u306b\u308f\u305f\u308b\u5171\u540c\u7814\u7a76\u958b\u767a\u30d1\u30fc\u30c8\u30ca\u30fc\u30b7\u30c3\u30d7\u306b\u57fa\u3065\u304f\u3082\u306e\u3067\u3001IBM\u3068\u6771\u4eac\u30a8\u30ec\u30af\u30c8\u30ed\u30f3\u306f\u30013D\u30c1\u30c3\u30d7\u7a4d\u5c64\u6280\u8853\u7528\u306e300mm\u30b7\u30ea\u30b3\u30f3\u30a6\u30a7\u30fc\u30cf\u3092\u88fd\u9020\u3059\u308b\u305f\u3081\u306e\u65b0\u3057\u3044\u30ec\u30fc\u30b6\u30fc\u5265\u96e2\u30d7\u30ed\u30bb\u30b9\u306e\u958b\u767a\u306a\u3069\u3001\u6570\u3005\u306e\u753b\u671f\u7684\u306a\u6210\u679c\u3092\u6319\u3052\u3066\u304d\u307e\u3057\u305f\u3002<\/p>

This collaboration brings together IBM’s expertise in semiconductor process integration technology and TEL’s expertise in cutting-edge semiconductor manufacturing equipment to explore smaller node and chiplet architecture technologies to achieve the performance and energy efficiency requirements of future AI generations.<\/p>

\u3053\u3061\u3089\u3082\u304a\u8aad\u307f\u304f\u3060\u3055\u3044\uff1a \u30bd\u30d5\u30c8\u30d0\u30f3\u30af\u30b0\u30eb\u30fc\u30d7\u3001\u30a2\u30f3\u30da\u30fc\u30eb\u30fb\u30b3\u30f3\u30d4\u30e5\u30fc\u30c6\u30a3\u30f3\u30b0\u3092\u8cb7\u53ce<\/a><\/strong><\/h4>

“IBM is committed to delivering on our vision for hybrid cloud,” said Mukesh Khare, general manager, IBM Semiconductors and vice president, IBM Hybrid Cloud.<\/p>

“IBM and TEL’s joint work over the past two decades has helped drive semiconductor technology innovation and delivered generations of chip performance and energy efficiency to the semiconductor industry. At this critical time, we are pleased to continue our collaboration to accelerate chip innovation powering the era of generative AI.”<\/p>

\u6771\u4eac\u30a8\u30ec\u30af\u30c8\u30ed\u30f3\u682a\u5f0f\u4f1a\u793e\u4ee3\u8868\u53d6\u7de0\u5f79\u793e\u9577\u517cCEO\u306e\u6cb3\u5408\u4fca\u6a39\u306f\u3001\u6b21\u306e\u3088\u3046\u306b\u8ff0\u3079\u3066\u3044\u307e\u3059\uff1a<\/p>

“IBM and Tokyo Electron have built a strong relationship of trust and innovation through many years of joint development. We are pleased to continue our long-standing partnership with IBM for another five years. This renewal demonstrates our commitment to advancing semiconductor technology, including high NA EUV patterning processes. Our collaboration at the Albany NanoTech Complex plays an important role in driving innovation, and we look forward to further developments in the future.”<\/p>

IBM\u3068\u6771\u4eac\u30a8\u30ec\u30af\u30c8\u30ed\u30f3\u306f\u3001NY CREATES\u304c\u6240\u6709\u30fb\u904b\u55b6\u3059\u308b\u4e16\u754c\u6700\u5148\u7aef\u306e\u534a\u5c0e\u4f53\u7814\u7a76\u30a8\u30b3\u30b7\u30b9\u30c6\u30e0\u3067\u3042\u308bAlbany NanoTech Complex\u306e\u30e1\u30f3\u30d0\u30fc\u3067\u3059\u3002IBM\u3001\u6771\u4eac\u30a8\u30ec\u30af\u30c8\u30ed\u30f3\u304a\u3088\u3073\u305d\u306e\u4ed6\u306e\u4f01\u696d\u306f\u9577\u5e74\u306b\u308f\u305f\u308a\u3001\u534a\u5c0e\u4f53\u30c1\u30c3\u30d7\u306e\u30a4\u30ce\u30d9\u30fc\u30b7\u30e7\u30f3\u3092\u52a0\u901f\u3059\u308b\u305f\u3081\u306b\u3001\u5b98\u6c11\u5171\u540c\u3067\u6700\u5148\u7aef\u306e\u534a\u5c0e\u4f53\u7814\u7a76\u65bd\u8a2d\u3092\u5efa\u8a2d\u3057\u3066\u304d\u307e\u3057\u305f\u3002\u305d\u306e\u7d50\u679c\u3001\u30a2\u30eb\u30d0\u30cb\u30fc\u30ca\u30ce\u30c6\u30af\u30b3\u30f3\u30d7\u30ec\u30c3\u30af\u30b9\u306f\u6628\u5e74\u3001\u7c73\u56fd\u521d\u306e\u56fd\u7acb\u534a\u5c0e\u4f53\u6280\u8853\u30bb\u30f3\u30bf\u30fc\u3067\u3042\u308bNSTC EUV Accelerator\u306b\u9078\u3070\u308c\u307e\u3057\u305f\u3002\u3053\u306e\u65b0\u3057\u3044\u5408\u610f\u306e\u4e00\u74b0\u3068\u3057\u3066 IBM<\/a> \u305d\u3057\u3066 TEL<\/a> researchers will actively engage in collaborative research and development, leveraging Albany’s unique ecosystem and research and development capabilities.<\/p>

\u30bd\u30fc\u30b9 PRTimes<\/a><\/strong><\/p>","protected":false},"excerpt":{"rendered":"

IBM and Tokyo Electron Limited (TEL) announced that they have extended their agreement for joint research and development of advanced semiconductor technologies. The new five-year agreement will focus on the continued advancement of next-generation semiconductor nodes and architectures that will support the era of generative AI.The agreement builds on more than 20 years of joint research and development partnership between IBM and TEL, which has resulted in several breakthroughs together, including the development of a new laser delamination process for manufacturing 300mm silicon chip wafers for 3D chip stacking technology.This collaboration brings together IBM’s expertise in semiconductor process integration technology and TEL’s expertise in cutting-edge semiconductor manufacturing equipment to explore 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