{"id":36120,"date":"2026-07-13T12:26:57","date_gmt":"2026-07-13T12:26:57","guid":{"rendered":"https:\/\/itbusinesstoday.com\/?p=36120"},"modified":"2026-07-13T12:26:57","modified_gmt":"2026-07-13T12:26:57","slug":"interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc","status":"publish","type":"post","link":"https:\/\/itbusinesstoday.com\/ja\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/","title":{"rendered":"Synopsys Inc.\u306eDFx\u30a2\u30d7\u30ea\u30b1\u30fc\u30b7\u30e7\u30f3\u30a8\u30f3\u30b8\u30cb\u30a2\u30ea\u30f3\u30b0\u62c5\u5f53\u30de\u30cd\u30fc\u30b8\u30e3\u30fc\u3001\u9234\u6728\u88d5\u4e5f\u6c0f\u3078\u306e\u30a4\u30f3\u30bf\u30d3\u30e5\u30fc."},"content":{"rendered":"

Yuya San, can you tell us about your professional background and your current role at Synopsys Inc.?<\/strong><\/p>\n

While I was in graduate school, I had the opportunity to learn about advanced packaging technologies for high-performance computing through an internship. At that time, Fujitsu was entering the early stages of development for the \u201cK\u201d supercomputer, and I was able to experience firsthand the ingenuity behind cutting-edge technology as well as the strong passion of the engineers involved.<\/p>\n

I later joined Fujitsu Semiconductor, where I worked on IP development for high-speed I\/O technologies used in high-performance computing SoCs and optical communication SoCs. I also served as an application engineer, supporting customers in addressing their technical challenges.<\/p>\n

Following the transition from Fujitsu Semiconductor to Socionext, I joined Synopsys in 2019 as an application engineer for DFT (Design-for-Test) EDA tools. Today, I serve as a manager for DFx (Design-for-X) EDA tools and SLM(Silicon Life Cycle Management) IP in the Japan region. DFx refers to a broader design methodology that considers testability, manufacturability, reliability, diagnosability, and quality from the early stages of design.<\/p>\n

In this role, I support Japan-based customers in solving challenges related to semiconductor design, test, monitoring, and product quality.<\/p>\n

Yuya san, your career has taken you from semiconductor library development at Fujitsu, to high-speed interface IP work at Socionext, and now to leading Synopsys\u2019 DFx efforts in Japan. Looking back, which experience most changed the way you think about solving customer problems, and why has that lesson stayed with you throughout your journey?<\/strong><\/p>\n

When I first joined Fujitsu, I thought of IP as something designed once and reused across multiple projects. However, through my work on custom SoC design, I learned that even when an IP block supports the same standard, customer requirements can differ significantly in terms of priorities and support needs.<\/p>\n

For startup customers, the first priority is often to demonstrate chip functionality as quickly as possible. In those cases, performance, schedule, and differentiated features may take precedence. For larger customers, however, the goal is often to refresh or replace existing products or systems, making standards-compliant interoperability, test quality, and production stability much more important.<\/p>\n

This experience taught me that focusing only on the completeness of the IP itself is not enough. It is critical to understand how the IP will be integrated into the customer\u2019s SoC, what constraints may exist, and what risks may arise in development and mass production. A technically correct answer is not always sufficient; the solution must also be realistic and executable.<\/p>\n

That lesson remains highly relevant in my current role leading DFT\/DFx activities in Japan at Synopsys. Today, DFT\/DFx is increasingly part of overall system design rather than a standalone process. That is why I focus on understanding what the customer ultimately wants to achieve, where the real challenge lies, and how tools, IP, and design flows can be combined into practical solutions that can be successfully implemented.<\/p>\n

Over the past decade, semiconductor development has become significantly more complex, with AI workloads, advanced packaging, and system-level requirements reshaping the industry. From your perspective, what has been the most meaningful shift, and how has it changed the conversations you have with customers today?<\/strong><\/p>\n

A decade ago, semiconductor demand was driven largely by mobile phones, consumer electronics, and industrial systems. Today, however, new applications such as AI workloads from hyperscalers, EVs, and autonomous driving are creating much stronger demand. As a result, expectations for computing performance, power efficiency, reliability, and development speed have changed significantly.<\/p>\n

This shift has rapidly increased circuit scale. We are now seeing large-scale SoCs that contain hundreds of design hierarchies. Automotive semiconductors, which once mainly used mature process technologies, are also moving toward larger-scale development using advanced process nodes as EVs and autonomous driving continue to evolve.<\/p>\n

In the DFT area, conventional technologies alone are no longer sufficient, as pin count, test time, test data volume, and test cost are becoming major bottlenecks. Customer discussions are no longer focused only on improving test coverage. Increasingly, we are discussing how to test large-scale SoCs efficiently while keeping test time and cost within a realistic range.<\/p>\n

To address these challenges, the industry is adopting technologies such as Streaming Fabric and High-Speed Access & Test (HSAT), which leverage high-speed I\/O bandwidth to move test data more efficiently and help reduce test cost and bottlenecks at scale. Overall, customer conversations have expanded beyond the capabilities of a single EDA tool. They are now focused on overall optimization from the early stages of design, including test architecture, data transfer, production test, and quality assurance.<\/p>\n

Design-for-Test often operates behind the scenes, yet it plays a critical role in bringing reliable products to market. For those outside the semiconductor industry, what are some of the misconceptions about DFT, and why do you believe its importance continues to grow with every new generation of chips?<\/strong><\/p>\n

From outside the semiconductor industry, a chip may simply be expected to work correctly. People may not often see the test and quality assurance processes behind that reliability. As a result, DFT\/DFx is sometimes viewed as additional logic or overhead, rather than as a core enabler of product quality.<\/p>\n

In reality, DFT\/DFx is essential to bringing reliable semiconductor products to market. Its role has expanded beyond manufacturing test to include in-system monitoring, diagnosis, lifecycle management, and early detection of potential failures.<\/p>\n

This is especially important as semiconductors are used in more critical systems. In data centers, DFT\/DFx-related technologies can help improve maintenance efficiency and reduce the risk of service downtime. In EVs, autonomous driving, and industrial systems, semiconductor failures can directly affect safety, making DFT\/DFx a key quality assurance technology.<\/p>\n

DFT\/DFx is becoming more important with each new chip generation because scaling and design complexity are changing failure mechanisms and yield risks. Advanced technologies such as FinFET and GAA require new fault models and a deeper understanding of process variation. At the same time, smaller defects and soft errors caused by external factors such as neutron radiation can have a larger system-level impact.<\/p>\n

As SoCs become larger and more complex, it is no longer realistic to ensure quality and reliability through conventional approaches alone. Testability, diagnosability, and in-system monitoring must be considered from the design stage. DFT\/DFx may operate behind the scenes, but as semiconductors increasingly support critical systems in society, its value will continue to grow.<\/p>\n

As the industry moves toward chiplet architectures and 3D integration, many companies are entering territory that did not exist a decade ago. What new testing and reliability questions are emerging in these environments, and which challenges do you believe the industry is still underestimating?<\/strong><\/p>\n

From a test perspective, chiplet technology can improve yield because each individual die can be made smaller. At the same time, integrating multiple dies into a single system creates new test and reliability challenges that are very different from those of traditional monolithic SoCs.<\/p>\n

In chiplet-based designs, signals are transmitted between dies through structures such as Through-Silicon Via (TSV)s and silicon interposers. Because these connections exist inside the chip or package, they are difficult to monitor directly from the outside. This makes it essential to provide access to each die and to observe, diagnose, and report the status of both the internal circuitry and the inter-die connections.<\/p>\n

The IEEE 1838 standard has been developed to address these test access challenges, and Synopsys is also working on test technologies that comply with this standard. Going forward, the key question will not only be how to test each die individually, but how to guarantee the quality and reliability of the entire system after multiple dies are integrated.<\/p>\n

UCIe (Universal Chiplet Interconnect Express) is also creating new challenges. It is no longer enough to verify logical connectivity; signal quality, margins, and the stability of die-to-die communication must also be evaluated. As interconnect density increases and pitch continues to shrink, test and repair methods will become increasingly important for detecting and addressing connection defects, process variation, and aging-related degradation.<\/p>\n

What I believe the industry still underestimates is the difficulty of shifting the focus of test from individual dies to the entire integrated system. Chiplets should not be viewed simply as components that can be combined together. Design, test, diagnosis, repair, production quality, and field reliability all need to be considered as part of one integrated strategy.<\/p>\n

With chiplets and 3D integration, when a problem occurs, it becomes more difficult to isolate whether the root cause lies in a particular die, a connection, or an interface. For this reason, testability, diagnosability, and reliability monitoring must be built into the design from the earliest stages.<\/p>\n

Industry forecasts suggest the semiconductor market could approach the trillion-dollar mark in 2026, driven largely by AI-related demand and increasingly complex silicon designs. From where you sit, what opportunities are exciting customers the most, and what new pressures are keeping engineering teams awake at night?<\/strong><\/p>\n

One of the opportunities customers are most excited about is improving design efficiency through AI.<\/p>\n

At the same time, AI-related demand is driving larger circuits and greater design complexity. Engineering teams are under increasing pressure to deliver larger-scale, higher-quality designs in less time and with limited resources.<\/p>\n

In this environment, expectations for AI are very high Assistive AI has already provided value by helping engineers, especially less experienced ones, access past knowledge and expertise more easily.<\/p>\n

Going forward, I believe expectations will shift toward Agentic AI that can understand design intent, generate design proposals, and drive feedback loops based on results. With this type of AI, engineers will need to clearly define design concepts and constraints, evaluate AI-generated results, and use them to guide the next stage of improvement.<\/p>\n

In that sense, Agentic AI will not simply automate tasks. It can become a powerful tool for supporting project leaders and experienced engineers facing resource constraints. This is especially valuable in complex areas such as DFT and system-level quality management, where engineers must balance coverage, cost, diagnosability, and reliability.<\/p>\n

Throughout your career, you\u2019ve worked closely with teams bringing sophisticated products from design to production. Looking back, what are some of the non-technical factors that often determine whether a project succeeds or struggles, even when the engineering itself is strong?<\/strong><\/p>\n

I believe the most important non-technical factor that determines whether a project succeeds or struggles is avoiding communication gaps. This is especially important in global business, where decision-making processes, and technical backgrounds can differ significantly depending on the country or organization. What may seem obvious to us is not always obvious to others.<\/p>\n

For that reason, it is extremely important to make an effort to understand what is important to them, as well as what constraints and context they may have. More specifically, active listening is essential in order to correctly understand their intent. It is also important to have the ability to verbalize complex issues and communicate them in a clear and structured way.<\/p>\n

In customer discussions, these capabilities are valuable not only for solving the immediate issue, but also for building trust and partnerships for future projects. By understanding the customer\u2019s vision and business goals, we can think more clearly about how we can contribute and propose solutions that are better aligned with their needs.<\/p>\n

I also believe that this ability to verbalize ideas will become even more important in the AI era. When interacting with AI, the output can vary significantly depending on how we define the objective and what assumptions or constraints we provide.<\/p>\n

Even when the engineering itself is strong, a project can struggle if stakeholders have different understandings, or if the objectives and priorities are not shared clearly. That is why I believe the ability to understand others, articulate the issues, and connect the team around a common goal is just as important as technical capability.<\/p>\n

Japan has a long history of excellence in semiconductor engineering and is now investing heavily in strengthening its future position in the global ecosystem. From your perspective, what strengths make Japan uniquely valuable today, and where do you see the greatest opportunities for the next generation of innovation?<\/strong><\/p>\n

I believe Japan has several significant strengths. Japan has many experienced engineers, as well as a culture that places great importance on quality, reliability, and manufacturability. This becomes a major advantage in areas such as advanced process technologies and advanced packaging, where the boundaries between design, manufacturing, test, and reliability are becoming increasingly closely connected. In these areas, what is needed is not only expertise in individual technologies, but also the ability to coordinate across design, manufacturing, test, and reliability. Japan\u2019s strengths\u2014careful engineering, a strong commitment to quality, and an emphasis on long-term relationships of trust\u2014can become powerful advantages in the next stage of semiconductor development.<\/p>\n

I believe the greatest opportunity for next-generation innovation lies in developing design talent in Japan that can fully utilize advanced process technologies, as well as building the ecosystem that supports that talent. Through that talent and ecosystem, Japan has a major opportunity to translate advanced technologies into high-quality product value that can be manufactured at scale.<\/p>\n

Across the many customer engagements and projectsyou\u2019ve been involved with, has there been a lesson or realization that surprised you and fundamentally changed how you approach engineering, collaboration, or leadership?<\/strong><\/p>\n

Across my work with many customers and projects, one of the most important lessons I have learned is that there is not always a single optimal solution.<\/p>\n

As someone in a position to provide EDA technologies and solutions, it can be tempting to propose technologies that are gaining attention in the industry or that our company is strategically focused on. However, each customer has different technical challenges, design flows, organizations, schedules, and production risks. A solution that works well for one customer may not be the right answer for another.<\/p>\n

For example, large-scale hierarchical DFT is one of the major trends today, but it is not always the best fit for every design. For relatively small-scale designs that include analog mixed-signal blocks, the impact on the design flow or circuit overhead may outweigh the benefits. The goal is not simply to apply the latest technology, but to select the right technology based on the customer\u2019s design scale, objectives, and constraints.<\/p>\n

That same idea applies to collaboration and leadership. Rather than pushing our own approach, it is important to understand the customer\u2019s background, priorities, and decision-making process, and to build a shared goal together. In leadership as well, there is no single correct style. Some situations require clear direction, while others require careful alignment and process management.<\/p>\n

For that reason, I believe it is important not to rely on one fixed approach, but to adapt flexibly depending on the situation. This insight applies across engineering, collaboration, and leadership, and it remains one of the ideas I value most in my work today.<\/p>\n

Looking ahead, AI, advanced packaging, chiplets, and increasingly interconnected systems are reshaping the future of semiconductor development. As someone working at the intersection of technology, customers, and innovation, what excites you most about the next decade, and what questions are you personally most curious to see the industry answer?<\/strong><\/p>\n

Until now, each stage of semiconductor development\u2014front-end design, DFT, back-end design, IP, and system design\u2014has often been optimized within its own domain. However, as AI, advanced packaging, chiplets, and highly interconnected systems continue to evolve, it will become increasingly difficult to meet customers\u2019 expectations for time-to-market, quality, and performance through isolated optimization alone.<\/p>\n

Going forward, design flows will become more integrated, where performance, power consumption, test quality, and reliability are considered together from the early stages of design.<\/p>\n

This is especially true for chiplets. Optimizing each die individually is no longer sufficient. The key question is how to maximize performance, quality, and reliability at the system level when multiple dies, IP, memory, interconnects, and packages are integrated.<\/p>\n

In this environment, DFT\/DFx will play an increasingly important role. As systems become more complex, it becomes harder to understand what is happening and where. With chiplets and 3D integration, ensuring observability and diagnosability within each die, across inter-die connections and the package, and even during system operation becomes critical. DFT\/DFx will evolve beyond manufacturing test and become a foundational technology for system-level quality, reliability, observability, and lifecycle management.<\/p>\n

Another major shift is the growing role of AI-powered semiconductor development. AI already enables many stages of the design process, including design exploration and optimization. As a result, engineers will increasingly move from manually building everything themselves to defining objectives and constraints, evaluating AI-generated results, and making final judgments on quality and direction.<\/p>\n

The question I am most interested in is how the industry will achieve quality, reliability, and time-to-market goals at the same time in this integrated design environment. What should be automated or entrusted to AI, where should humans make the final judgment, and how should final responsibility for quality be ensured? I am very interested to see how the industry answers these questions.<\/p>","protected":false},"excerpt":{"rendered":"

Yuya San, can you tell us about your professional background and your current role at Synopsys Inc.? While I was in graduate school, I had the opportunity to learn about advanced packaging technologies for high-performance computing through an internship. At that time, Fujitsu was entering the early stages of development for the \u201cK\u201d supercomputer, and I was able to experience firsthand the ingenuity behind cutting-edge technology as well as the strong passion of the engineers involved. I later joined Fujitsu Semiconductor, where I worked on IP development for high-speed I\/O technologies used in high-performance computing SoCs and optical communication SoCs. I also served as an application engineer, supporting customers in […]<\/p>\n","protected":false},"author":7,"featured_media":36123,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"wprm-recipe-roundup-name":"","wprm-recipe-roundup-description":"","postBodyCss":"","postBodyMargin":[],"postBodyPadding":[],"postBodyBackground":{"backgroundType":"classic","gradient":""},"footnotes":""},"categories":[6472],"tags":[14061,4142,2164,14060,10899],"ppma_author":[572],"class_list":["post-36120","post","type-post","status-publish","format-standard","has-post-thumbnail","category-interviews","tag-design-for-x","tag-eda-tools","tag-on-semiconductor","tag-silicon-life-cycle","tag-synopsys"],"yoast_head":"\nInterview with Yuya Suzuki of Synopsys<\/title>\n<meta name=\"description\" content=\"In this interview, Yuya Suzuki explains how DFx application engineering is shaping the future of semiconductor design and manufacturing.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/itbusinesstoday.com\/ja\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/\" \/>\n<meta property=\"og:locale\" content=\"ja_JP\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Interview with Yuya Suzuki of Synopsys\" \/>\n<meta property=\"og:description\" content=\"In this interview, Yuya Suzuki explains how DFx application engineering is shaping the future of semiconductor design and manufacturing.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/itbusinesstoday.com\/ja\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/\" \/>\n<meta property=\"og:site_name\" content=\"itbusinesstoday\" \/>\n<meta property=\"article:published_time\" content=\"2026-07-13T12:26:57+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2026\/07\/Yuya-Suzuki.webp\" \/>\n\t<meta property=\"og:image:width\" content=\"1200\" \/>\n\t<meta property=\"og:image:height\" content=\"800\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/webp\" \/>\n<meta name=\"author\" content=\"ITBT StaffWriter\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"\u57f7\u7b46\u8005\" \/>\n\t<meta name=\"twitter:data1\" content=\"ITBT StaffWriter\" \/>\n\t<meta name=\"twitter:label2\" content=\"\u63a8\u5b9a\u8aad\u307f\u53d6\u308a\u6642\u9593\" \/>\n\t<meta name=\"twitter:data2\" content=\"13\u5206\" \/>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Interview with Yuya Suzuki of Synopsys","description":"In this interview, Yuya Suzuki explains how DFx application engineering is shaping the future of semiconductor design and manufacturing.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/itbusinesstoday.com\/ja\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/","og_locale":"ja_JP","og_type":"article","og_title":"Interview with Yuya Suzuki of Synopsys","og_description":"In this interview, Yuya Suzuki explains how DFx application engineering is shaping the future of semiconductor design and manufacturing.","og_url":"https:\/\/itbusinesstoday.com\/ja\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/","og_site_name":"itbusinesstoday","article_published_time":"2026-07-13T12:26:57+00:00","og_image":[{"width":1200,"height":800,"url":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2026\/07\/Yuya-Suzuki.webp","type":"image\/webp"}],"author":"ITBT StaffWriter","twitter_card":"summary_large_image","twitter_misc":{"\u57f7\u7b46\u8005":"ITBT StaffWriter","\u63a8\u5b9a\u8aad\u307f\u53d6\u308a\u6642\u9593":"13\u5206"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/#article","isPartOf":{"@id":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/"},"author":{"name":"ITBT StaffWriter","@id":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/#\/schema\/person\/94fb575e469aff25a4b938814d050f15"},"headline":"Interview with Yuya Suzuki, Manager of DFx Application Engineering @ Synopsys Inc.","datePublished":"2026-07-13T12:26:57+00:00","mainEntityOfPage":{"@id":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/"},"wordCount":2835,"publisher":{"@id":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/#organization"},"image":{"@id":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/#primaryimage"},"thumbnailUrl":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2026\/07\/Yuya-Suzuki.webp","keywords":["Design-for-X","EDA Tools","ON Semiconductor","Silicon Life Cycle","Synopsys"],"articleSection":["Interviews"],"inLanguage":"ja"},{"@type":"WebPage","@id":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/","url":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/","name":"Interview with Yuya Suzuki of Synopsys","isPartOf":{"@id":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/#website"},"primaryImageOfPage":{"@id":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/#primaryimage"},"image":{"@id":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/#primaryimage"},"thumbnailUrl":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2026\/07\/Yuya-Suzuki.webp","datePublished":"2026-07-13T12:26:57+00:00","description":"In this interview, Yuya Suzuki explains how DFx application engineering is shaping the future of semiconductor design and manufacturing.","breadcrumb":{"@id":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/#breadcrumb"},"inLanguage":"ja","potentialAction":[{"@type":"ReadAction","target":["https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/"]}]},{"@type":"ImageObject","inLanguage":"ja","@id":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/#primaryimage","url":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2026\/07\/Yuya-Suzuki.webp","contentUrl":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2026\/07\/Yuya-Suzuki.webp","width":1200,"height":800,"caption":"Synopsys"},{"@type":"BreadcrumbList","@id":"https:\/\/itbusinesstoday.com\/interviews\/interview-with-yuya-suzuki-manager-of-dfx-application-engineering-synopsys-inc\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/itbusinesstoday.com\/"},{"@type":"ListItem","position":2,"name":"Interview with Yuya Suzuki, Manager of DFx Application Engineering @ Synopsys Inc."}]},{"@type":"WebSite","@id":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/#website","url":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/","name":"\u30a4\u30c3\u30c8\u30d3\u30b8\u30cd\u30b9\u30c8\u30a5\u30c7\u30a4","description":"","publisher":{"@id":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"ja"},{"@type":"Organization","@id":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/#organization","name":"\u30a4\u30c3\u30c8\u30d3\u30b8\u30cd\u30b9\u30c8\u30a5\u30c7\u30a4","url":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/","logo":{"@type":"ImageObject","inLanguage":"ja","@id":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/#\/schema\/logo\/image\/","url":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2025\/01\/Asset-1.png","contentUrl":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2025\/01\/Asset-1.png","width":663,"height":275,"caption":"itbusinesstoday"},"image":{"@id":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/itbusinesstoday-68b209.ingress-baronn.ewp.live\/#\/schema\/person\/94fb575e469aff25a4b938814d050f15","name":"ITBT\u30b9\u30bf\u30c3\u30d5\u30e9\u30a4\u30bf\u30fc","image":{"@type":"ImageObject","inLanguage":"ja","@id":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2025\/01\/Favicon-1.png90b3cb23d1d9c08733d969d29ea2d30d","url":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2025\/01\/Favicon-1.png","contentUrl":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2025\/01\/Favicon-1.png","caption":"ITBT StaffWriter"},"description":"ITBT\u30b9\u30bf\u30c3\u30d5\u30e9\u30a4\u30bf\u30fc\u306f\u3001IT Business Today\u306e\u793e\u5185\u5bc4\u7a3f\u8005\u3067\u3001\u30bf\u30a4\u30e0\u30ea\u30fc\u306a\u30cb\u30e5\u30fc\u30b9\u3068QuickBytes\u306e\u914d\u4fe1\u3092\u62c5\u5f53\u3057\u3066\u3044\u307e\u3059\u3002IT\u3001\u30cf\u30a4\u30c6\u30af\u3001\u4f01\u696d\u30bd\u30ea\u30e5\u30fc\u30b7\u30e7\u30f3\u306e\u6700\u65b0\u52d5\u5411\u3092\u30ab\u30d0\u30fc\u3057\u3001\u7c21\u6f54\u3067\u30a4\u30f3\u30d1\u30af\u30c8\u306e\u3042\u308b\u6700\u65b0\u60c5\u5831\u3092\u8aad\u8005\u306b\u63d0\u4f9b\u3057\u3066\u3044\u307e\u3059\u3002","sameAs":["https:\/\/itbusinesstoday.com\/"],"url":"https:\/\/itbusinesstoday.com\/ja\/author\/itbt-staffwriter\/"}]}},"authors":[{"term_id":572,"user_id":7,"is_guest":0,"slug":"itbt-staffwriter","display_name":"ITBT StaffWriter","avatar_url":{"url":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2025\/01\/Favicon-1.png","url2x":"https:\/\/itbusinesstoday.com\/wp-content\/uploads\/2025\/01\/Favicon-1.png"},"0":null,"1":"","2":"","3":"","4":"","5":"","6":"","7":"","8":""}],"_links":{"self":[{"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/posts\/36120","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/users\/7"}],"replies":[{"embeddable":true,"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/comments?post=36120"}],"version-history":[{"count":2,"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/posts\/36120\/revisions"}],"predecessor-version":[{"id":36136,"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/posts\/36120\/revisions\/36136"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/media\/36123"}],"wp:attachment":[{"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/media?parent=36120"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/categories?post=36120"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/tags?post=36120"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/itbusinesstoday.com\/ja\/wp-json\/wp\/v2\/ppma_author?post=36120"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}