A consortium of 12 Japanese and U. S. semiconductor related companies has officially opened a new development base in Silicon Valley, a major milestone in the cross-border collaboration in chip innovation. This initiative, called “US-Joint, ” is a collaboration of the leading materials and equipment companies to together develop next-generation semiconductor technologies.<\/p>\n
The center will mainly work on how to finalize and deliver the chips – including their assembly, packaging, and finally product integration. This process is getting more and more important since the advancements in chip performance are now dependent not only on the fabrication but also on the packaging.<\/p>\n
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Opening this base fits perfectly with Japan’s larger plan to bring back and make its semiconductor industry stronger. Japan was once the world leader in making semiconductor chips but now is concentrating more on top value segments such as materials, equipment, and advanced packaging.<\/p>\n
Working together with U. S. partners, Japan is setting itself up as the hub of a more resistant and diversified global supply chain. This move goes well with Japan’s domestic efforts that include government-backed ventures such as Rapidus Corporation, which plans to manufacture state-of-the-art chips in Japan by the late 2020s.<\/p>\n
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\u65e5\u7c73\u306e\u5354\u529b\u95a2\u4fc2\u306e\u91cd\u8981\u6027\u306f\u3001\u4e21\u56fd\u3060\u3051\u306b\u3068\u3069\u307e\u308a\u307e\u305b\u3093\u3002AI\u3001\u30af\u30e9\u30a6\u30c9\u30b3\u30f3\u30d4\u30e5\u30fc\u30c6\u30a3\u30f3\u30b0\u3001\u30c9\u30e9\u30a4\u30d0\u30fc\u30ec\u30b9\u6280\u8853\u306b\u3088\u3063\u3066\u9ad8\u6027\u80fd\u30c1\u30c3\u30d7\u306e\u9700\u8981\u304c\u6025\u901f\u306b\u9ad8\u307e\u308b\u4e2d\u3001\u9ad8\u5ea6\u306a\u30d1\u30c3\u30b1\u30fc\u30b8\u30f3\u30b0\u304c\u88fd\u54c1\u5dee\u5225\u5316\u306e\u91cd\u8981\u306a\u8981\u7d20\u3068\u306a\u308a\u3064\u3064\u3042\u308a\u307e\u3059\u3002.<\/p>\n
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The partnership’s emphasis on these technologies is a move that will make it the leader of this change. Since it will facilitate quicker product development and a closer working relationship between suppliers and end-users, the location of the Silicon Valley could be a point of rapid commercialization of the new generation of semiconductor solutions.<\/p>\n
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AI\u6280\u8853\u304c\u5c11\u3057\u305a\u3064\u8907\u96d1\u5316\u3057\u3001\u30c8\u30c3\u30d7\u30ec\u30d9\u30eb\u306e\u7701\u30a8\u30cd\u30eb\u30ae\u30fc\u30b3\u30f3\u30d4\u30e5\u30fc\u30bf\u30c1\u30c3\u30d7\u306e\u9700\u8981\u304c\u6025\u901f\u306b\u9ad8\u307e\u3063\u3066\u3044\u308b\u305f\u3081\u3001\u3053\u306e\u30b0\u30eb\u30fc\u30d7\u304c\u30b9\u30bf\u30fc\u30c8\u3057\u305f\u6642\u671f\u306f\u975e\u5e38\u306b\u91cd\u8981\u3067\u3059\u3002\u30a2\u30c9\u30d0\u30f3\u30b9\u30c8\u30fb\u30d1\u30c3\u30b1\u30fc\u30b8\u30f3\u30b0\u306f\u3001\u8907\u6570\u306e\u30c1\u30c3\u30d7\u90e8\u54c1\u3092\u3088\u308a\u3088\u304f\u7d71\u5408\u3059\u308b\u3053\u3068\u304c\u3067\u304d\u308b\u305f\u3081\u3001\u8981\u6c42\u3092\u6e80\u305f\u3059\u305f\u3081\u306e\u975e\u5e38\u306b\u52b9\u679c\u7684\u306a\u65b9\u6cd5\u3067\u3059\u3002.<\/p>\n
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US-Joint\u30a4\u30cb\u30b7\u30a2\u30c1\u30d6\u306f\u3001\u56fd\u5883\u3084\u30d0\u30ea\u30e5\u30fc\u30c1\u30a7\u30fc\u30f3\u306e\u7570\u306a\u308b\u90e8\u5206\u3092\u8d85\u3048\u3066\u5354\u529b\u3057\u5408\u3046\u3068\u3044\u3046\u3001\u534a\u5c0e\u4f53\u30a4\u30ce\u30d9\u30fc\u30b7\u30e7\u30f3\u306e\u65b0\u3057\u3044\u65b9\u6cd5\u306e\u6a21\u7bc4\u3092\u793a\u3057\u3066\u3044\u307e\u3059\u3002\u500b\u3005\u306b\u52aa\u529b\u3059\u308b\u306e\u3067\u306f\u306a\u304f\u3001\u8a2d\u5099\u3084\u30ce\u30a6\u30cf\u30a6\u3092\u5171\u6709\u3057\u3001\u6700\u5148\u7aef\u306e\u6280\u8853\u8ab2\u984c\u306b\u53d6\u308a\u7d44\u3080\u3068\u3044\u3046\u70b9\u3067\u3001\u4f01\u696d\u306f\u624b\u3092\u643a\u3048\u3066\u3044\u307e\u3059\u3002.<\/p>\n
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A consortium of 12 Japanese and U. S. semiconductor related companies has officially opened a new development base in Silicon Valley, a major milestone in the cross-border collaboration in chip innovation. This initiative, called “US-Joint, ” is a collaboration of the leading materials and equipment companies to together develop next-generation semiconductor technologies. The center will mainly work on how to finalize and deliver the chips – including their assembly, packaging, and finally product integration. This process is getting more and more important since the advancements in chip performance are now dependent not only on the fabrication but also on the packaging. Focus on Next-Generation Chip Packaging Rather than focusing on […]<\/p>\n","protected":false},"author":7,"featured_media":31841,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"wprm-recipe-roundup-name":"","wprm-recipe-roundup-description":"","postBodyCss":"","postBodyMargin":[],"postBodyPadding":[],"postBodyBackground":{"backgroundType":"classic","gradient":""},"footnotes":""},"categories":[84,8098,192],"tags":[218,9011,384,9389,12640],"ppma_author":[572],"class_list":{"0":"post-31840","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-industrial-tech","8":"category-news-articles","9":"category-semiconductorandelectronics","10":"tag-ai","11":"tag-chip-innovation","12":"tag-cloud","13":"tag-semiconductors-electronics","14":"tag-silicon-valley"},"yoast_head":"\n