{"id":20511,"date":"2025-09-04T12:21:05","date_gmt":"2025-09-04T12:21:05","guid":{"rendered":"https:\/\/itbusinesstoday.com\/?p=20511"},"modified":"2025-09-04T12:21:05","modified_gmt":"2025-09-04T12:21:05","slug":"resonac-launches-27-member-joint3-consortium-to-develop-next-generation-semiconductor-packaging","status":"publish","type":"post","link":"https:\/\/itbusinesstoday.com\/ja\/industrial-tech\/semiconductorandelectronics\/resonac-launches-27-member-joint3-consortium-to-develop-next-generation-semiconductor-packaging\/","title":{"rendered":"\u30ec\u30be\u30ca\u30c3\u30af\u3001\u6b21\u4e16\u4ee3\u534a\u5c0e\u4f53\u30d1\u30c3\u30b1\u30fc\u30b8\u958b\u767a\u306e\u305f\u3081\u306e27\u30e1\u30f3\u30d0\u30fc\u304b\u3089\u306a\u308b \"JOINT3 \"\u30b3\u30f3\u30bd\u30fc\u30b7\u30a2\u30e0\u3092\u767a\u8db3"},"content":{"rendered":"

Resonac Corporation  announced the establishment of “JOINT3,” a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a prototype production line for the manufacture of 515 x 510mm panel-level organic interposers.<\/p>

Resonac<\/a> will establish an “Advanced Panel Level Interposer Center (APLIC)” as the main hub for this initiative within its Shimodate Plant (Minami-yuki) in Yuki City, in Japan’s Ibaraki Prefecture. APLIC will house the prototype production line, which is scheduled to commence operations in 2026.<\/p>

\u3053\u306e\u30b3\u30f3\u30bd\u30fc\u30b7\u30a2\u30e0\u3067\u306f\u3001\u5b9f\u4e16\u754c\u306e\u69cb\u9020\u3092\u5fe0\u5b9f\u306b\u53cd\u6620\u3057\u305f\u691c\u8a3c\u7d50\u679c\u3092\u63d0\u4f9b\u3059\u308b\u3053\u3068\u3067\u3001\u958b\u767a\u52aa\u529b\u3092\u52a0\u901f\u3057\u307e\u3059\u3002<\/p>

\u8fd1\u5e74\u3001\u6b21\u4e16\u4ee3\u534a\u5c0e\u4f53\u306e\u5206\u91ce\u3067\u306f\u3001\u5f8c\u5de5\u7a0b\u306e\u30d1\u30c3\u30b1\u30fc\u30b8\u30f3\u30b0\u304c\u91cd\u8981\u306a\u6280\u8853\u3068\u3057\u3066\u6ce8\u76ee\u3055\u308c\u3066\u3044\u307e\u3059\u3002\u3053\u306e\u4e2d\u306b\u306f\u3001\u8907\u6570\u306e\u534a\u5c0e\u4f53\u30c1\u30c3\u30d7\u3092\u4e26\u5217\u306b\u914d\u7f6e\u3057\u3001\u30a4\u30f3\u30bf\u30fc\u30dd\u30fc\u30b6\u3092\u4ecb\u3057\u3066\u63a5\u7d9a\u3059\u308b2.xD\u30d1\u30c3\u30b1\u30fc\u30b8\u3082\u542b\u307e\u308c\u3001\u30c7\u30fc\u30bf\u901a\u4fe1\u306e\u5927\u5bb9\u91cf\u5316\u30fb\u9ad8\u901f\u5316\u306e\u30cb\u30fc\u30ba\u306b\u4f34\u3044\u3001\u9700\u8981\u306e\u62e1\u5927\u304c\u898b\u8fbc\u307e\u308c\u3066\u3044\u307e\u3059\u3002\u534a\u5c0e\u4f53\u306e\u9ad8\u6027\u80fd\u5316\u306b\u4f34\u3044\u3001\u30a4\u30f3\u30bf\u30fc\u30dd\u30fc\u30b6\u30fc\u306e\u5927\u578b\u5316\u304c\u9032\u307f\u3001\u30b7\u30ea\u30b3\u30f3\u30a4\u30f3\u30bf\u30fc\u30dd\u30fc\u30b6\u30fc\u304b\u3089\u6709\u6a5f\u6750\u6599\u3092\u7528\u3044\u305f\u6709\u6a5f\u30a4\u30f3\u30bf\u30fc\u30dd\u30fc\u30b6\u30fc\u3078\u306e\u79fb\u884c\u304c\u9032\u3093\u3067\u3044\u307e\u3059\u3002<\/p>

\u3053\u3061\u3089\u3082\u304a\u8aad\u307f\u304f\u3060\u3055\u3044\uff1a \u30b1\u30a4\u30c7\u30f3\u30b9\u3001\u30a4\u30f3\u30c6\u30eb18A\u304a\u3088\u307318A-P\u30c1\u30c3\u30d7\u5411\u3051\u30c7\u30b6\u30a4\u30f3IP\u3092\u62e1\u5f35<\/a><\/strong><\/h4>

\u5f93\u6765\u306e\u88fd\u9020\u65b9\u6cd5\u3067\u306f\u3001\u5186\u5f62\u306e\u30a6\u30a7\u30cf\u30fc\u304b\u3089\u9577\u65b9\u5f62\u306e\u30d4\u30fc\u30b9\u3092\u5207\u308a\u51fa\u3057\u307e\u3059\u3002\u3057\u304b\u3057\u3001\u30a4\u30f3\u30bf\u30fc\u30dd\u30fc\u30b6\u30fc\u306e\u5927\u578b\u5316\u306b\u4f34\u3044\u30011\u679a\u306e\u30a6\u30a7\u30cf\u30fc\u304b\u3089\u5f97\u3089\u308c\u308b\u30a4\u30f3\u30bf\u30fc\u30dd\u30fc\u30b6\u30fc\u306e\u6570\u304c\u6e1b\u5c11\u3059\u308b\u3053\u3068\u304c\u5927\u304d\u306a\u8ab2\u984c\u3068\u306a\u3063\u3066\u3044\u307e\u3059\u3002\u305d\u3053\u3067\u3001\u5186\u5f62\u30a6\u30a7\u30fc\u30cf\u304b\u3089\u6b63\u65b9\u5f62\u306e\u30d1\u30cd\u30eb\u5f62\u72b6\u306b\u79fb\u884c\u3059\u308b\u3053\u3068\u3067\u3001\u4e00\u5b9a\u9762\u7a4d\u306e\u30a6\u30a7\u30fc\u30cf\u304b\u3089\u5f97\u3089\u308c\u308b\u30a4\u30f3\u30bf\u30fc\u30dd\u30fc\u30b6\u30fc\u306e\u6570\u3092\u5897\u3084\u3059\u88fd\u9020\u65b9\u6cd5\u304c\u6ce8\u76ee\u3055\u308c\u3066\u3044\u307e\u3059\u3002<\/p>

\u30ec\u30be\u30ca\u30c3\u30af\u306f\u3001JOINT3\u30b3\u30f3\u30bd\u30fc\u30b7\u30a2\u30e0\u306e\u30ea\u30fc\u30c0\u30fc\u3068\u3057\u3066\u3001\u7814\u7a76\u958b\u767a\u306e\u512a\u5148\u9806\u4f4d\u3092\u63d0\u6848\u3059\u308b\u3068\u3068\u3082\u306b\u3001\u8a66\u4f5c\u30e9\u30a4\u30f3\u306e\u904b\u55b6\u3092\u7ba1\u7406\u3057\u3001\u69cb\u60f3\u5168\u4f53\u306e\u9032\u6357\u3092\u63a8\u9032\u3057\u307e\u3059\u3002\u307e\u305f\u3001\u53c2\u52a0\u4f01\u696d\u3068\u306e\u5171\u5275\u306b\u3088\u308a\u3001\u30d1\u30cd\u30eb\u30ec\u30d9\u30eb\u306e\u6709\u6a5f\u30a4\u30f3\u30bf\u30fc\u30dd\u30fc\u30b6\u306b\u6700\u9069\u306a\u6750\u6599\u958b\u767a\u3092\u63a8\u9032\u3057\u307e\u3059\u3002<\/p>

Hidehito Takahashi, President and CEO of Resonac Holdings Corporation stated “JOINT3 brings together world-class companies from a variety of fields. Combining the complementary strengths and expertise of each company allows us to collectively address challenges in areas that were previously unreachable. This endeavor goes beyond mere technological development and will lead to solutions that address societal challenges. We are excited by the potential that this initiative offers.”<\/p>

Sumie Segawa, Vice President & General Manager, Division Officer, Corporate Innovation Division of Tokyo Electron Ltd., a participating company, commented, “Advanced packaging for AI semiconductors depends on miniaturization for high speed signaling and lower power, together with scaling for greater capacity. By combining JOINT3’s interposer technology with Japan’s superior materials and processing expertise, we will enable high quality, reliable manufacturing and jointly pursue further advances in AI semiconductors.”<\/p>

William F. Mackenzie, Group Managing Executive Officer, Ushio Inc., another participating company, remarked, “Advanced packaging is entering a new era, demanding innovation and collaboration across the ecosystem. As a core enabler, lithography is key to meeting these challenges. Through our Digital Lithography Technology and partnership in the JOINT3 consortium, Ushio is working with industry leaders to deliver the precision and performance the future demands.”<\/p>

Resonac will leverage the knowledge gained from the semiconductor packaging technology development consortia “JOINT” and “JOINT2,” which transcend the boundaries of semiconductor equipment and materials manufacturers, as well as that sourced from “US-JOINT,” which is being developed in Silicon Valley in the United States. By doing so, Resonac aim to contribute to technological innovation in next-generation semiconductor packaging.<\/p>

\u30bd\u30fc\u30b9 BusinessWire<\/a><\/strong><\/p>","protected":false},"excerpt":{"rendered":"

Resonac Corporation  announced the establishment of “JOINT3,” a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a prototype production line for the manufacture of 515 x 510mm panel-level organic interposers.Resonac will establish an “Advanced Panel Level Interposer Center (APLIC)” as the main hub for this initiative within its Shimodate Plant (Minami-yuki) in Yuki City, in Japan’s Ibaraki […]<\/p>\n","protected":false},"author":4,"featured_media":20518,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"wprm-recipe-roundup-name":"","wprm-recipe-roundup-description":"","postBodyCss":"","postBodyMargin":[],"postBodyPadding":[],"postBodyBackground":{"backgroundType":"classic","gradient":""},"footnotes":""},"categories":[84,207,192],"tags":[7610,7609,105,7607,7608,106,3499,7611,7606],"ppma_author":[205],"class_list":["post-20511","post","type-post","status-publish","format-standard","has-post-thumbnail","category-industrial-tech","category-international","category-semiconductorandelectronics","tag-design-tools","tag-equipment","tag-itbusinesstoday","tag-joint3","tag-materials","tag-news","tag-resonac","tag-semiconductor-equipment","tag-semiconductor-packaging"],"yoast_head":"\nResonac Launches JOINT3 Consortium for Chip Packaging<\/title>\n<meta name=\"description\" content=\"Resonac and 26 global partners launch JOINT3 to co-develop panel-level organic interposer tech, advancing semiconductor packaging innovation.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/itbusinesstoday.com\/ja\/industrial-tech\/semiconductorandelectronics\/resonac-launches-27-member-joint3-consortium-to-develop-next-generation-semiconductor-packaging\/\" \/>\n<meta property=\"og:locale\" content=\"ja_JP\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Resonac Launches JOINT3 Consortium for Chip Packaging\" \/>\n<meta property=\"og:description\" content=\"Resonac and 26 global partners launch JOINT3 to co-develop panel-level organic interposer tech, advancing semiconductor packaging innovation.\" \/>\n<meta property=\"og:url\" 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